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STM32L162VD Datasheet(PDF) 109 Page - STMicroelectronics |
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STM32L162VD Datasheet(HTML) 109 Page - STMicroelectronics |
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109 / 115 page ![]() DocID027268 Rev 3 109/115 STM32L162VD-X Package information 114 Figure 28. WLCSP104, 0.4 mm pitch wafer level chip scale package recommended footprint Table 64. WLCSP104, 0.4 mm pitch wafer level chip scale package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A 0.525 0.555 0.585 0.0207 0.0219 0.023 A1 - 0.175 - - 0.0069 - A2 - 0.38 - - 0.015 - A3(2) 2. Back side coating. - 0.025 - - 0.001 - ø b(3) 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 0.22 0.25 0.28 0.0087 0.0098 0.011 D 4.06 4.095 4.13 0.1598 0.1612 0.1626 E 5.059 5.094 5.129 0.1992 0.2006 0.2019 e - 0.4 - - 0.0157 - e1 - 3.2 - - 0.126 - e2 - 4.4 - - 0.1732 - F - 0.447 - - 0.0176 - G - 0.347 - - 0.0137 - aaa - - 0.1 - - 0.0039 bbb - - 0.1 - - 0.0039 ccc - - 0.1 - - 0.0039 ddd - - 0.05 - - 0.002 eee - - 0.05 - - 0.002 |
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