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STM32L031C6 Datasheet(PDF) 107 Page - STMicroelectronics |
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STM32L031C6 Datasheet(HTML) 107 Page - STMicroelectronics |
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107 / 118 page  DocID027063 Rev 4 107/118 STM32L031x4/6 Package information 114 Figure 47. WLCSP25 - 2.097 x 2.493 mm, 0.400 mm pitch wafer level chip scale recommended footprint aaa 0.1000 - - 0.0039 - - bbb 0.1000 - - 0.0039 - - ccc 0.1000 - - 0.0039 - - ddd 0.0500 - - 0.0020 - - eee 0.0500 - - 0.0020 - - 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Back side coating. 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 74. WLCSP25 - 2.097 x 2.493 mm, 0.400 mm pitch wafer level chip scale mechanical data Symbol Milimeters Inches(1) Min Typ Max Min Typ Max Table 75. WLCSP25 recommended PCB design rules Dimension Recommended values Pitch 0.4 mm Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed |
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