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STM32F301C6 Datasheet(PDF) 118 Page - STMicroelectronics |
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STM32F301C6 Datasheet(HTML) 118 Page - STMicroelectronics |
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118 / 135 page ![]() Package information STM32F301x6 STM32F301x8 118/135 DocID025146 Rev 6 Device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. Figure 38. WLCSP49 marking example (package top view) 1. Parts marked as "ES", "E" or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering Samples to run qualification activity. Table 76. WLCSP49 recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed. |
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