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ST7FOXA0 Datasheet(PDF) 121 Page - STMicroelectronics |
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ST7FOXA0 Datasheet(HTML) 121 Page - STMicroelectronics |
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121 / 123 page  ST7FOXA0 Package mechanical data 121/123 14.1 Thermal characteristics Table 66. Thermal characteristics Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) SO8 130 °C/W DIP8 82 TJmax Maximum junction temperature(1) 1. The maximum chip-junction temperature is based on technology characteristics. 150 °C PDmax Power dissipation(2) 2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the ports used in the application. SO8 180 mW DIP8 300 Obsolete Product(s) - Obsolete Product(s) |
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