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ST7LITE49K2 Datasheet(PDF) 243 Page - STMicroelectronics |
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ST7LITE49K2 Datasheet(HTML) 243 Page - STMicroelectronics |
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243 / 245 page ![]() ST7LITE49K2 Package mechanical data 243/245 15.1 Thermal characteristics L1 1.00 0.0394 Number of pins N32 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 113. 32-pin low profile quad flat package (7x7), package mechanical data Dim. mm inches(1) Min Typ Max Min Typ Max Table 114. Thermal characteristics Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) LQFP32 SDIP32 55 58 °C/W TJmax Maximum junction temperature(1) 1. The maximum chip-junction temperature is based on technology characteristics. 150 °C PDmax Power dissipation(2) 2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the ports used in the application. 160 mW |
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