STM32F378RC datasheet(112/131 Pages) STMICROELECTRONICS

112 / 131 page

Package information

STM32F378xx

112/131

DocID025608 Rev 4

Figure 33. UFBGA100 - 100-pin, 7 x 7 mm, 0.50 mm pitch,

ultra fine pitch ball grid array package recommended footprint

6.950

7.000

7.050

0.2736

0.2756

0.2776

5.450

5.500

5.550

0.2146

0.2165

0.2185

6.950

7.000

7.050

0.2736

0.2756

0.2776

5.450

5.500

5.550

0.2146

0.2165

0.2185

0.500

0.0197

0.700

0.750

0.800

0.0276

0.0295

0.0315

ddd

0.100

0.0039

eee

0.150

0.0059

fff

0.050

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Table 73. UFBGA100 recommended PCB design rules (0.5 mm pitch BGA)

Dimension

Recommended values

Pitch

0.5

Dpad

0.280 mm

Dsm

0.370 mm typ. (depends on the soldermask

registration tolerance)

Stencil opening

0.280 mm

Stencil thickness

Between 0.100 mm and 0.125 mm

Table 72. UFBGA100 - 100-pin, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array

package mechanical data (continued)

Symbol

millimeters

inches(1)

Min.

Typ.

Max.

Min.

Typ.

Max.

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