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STM32F401CD Datasheet(PDF) 129 Page - STMicroelectronics |
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STM32F401CD Datasheet(HTML) 129 Page - STMicroelectronics |
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129 / 135 page  DocID025644 Rev 3 129/135 STM32F401xD STM32F401xE Package characteristics 133 Figure 59. Recommended PCB design rules for pads (0.5 mm-pitch BGA) 1. Non solder mask defined (NSMD) pads are recommended. 2. 4 to 6 mils solder paste screen printing process. ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 84. UFBGA100, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. Pitch 0.5 mm D pad 0.27 mm Dsm 0.35 mm typ (depends on the soldermask registration tolerance) Solder paste 0.27 mm aperture diameter Dpad Dsm ai15495 |
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