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STM32L062T8 Datasheet(PDF) 102 Page - STMicroelectronics |
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STM32L062T8 Datasheet(HTML) 102 Page - STMicroelectronics |
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102 / 118 page ![]() Package information STM32L062x8 102/118 DocID025937 Rev 8 7.2 Thin WLCSP36 package information Figure 34. Thin WLCSP36 - 2.61 x 2.88 mm, 0.4 mm pitch wafer level chip scale package outline 1. Drawing is not to scale. 2. b dimensions is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. |
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