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STM32L100X6 Datasheet(PDF) 101 Page - STMicroelectronics |
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STM32L100X6 Datasheet(HTML) 101 Page - STMicroelectronics |
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101 / 102 page ![]() DocID025966 Rev 5 101/102 STM32L100x6/8/B-A Revision history 101 9 Revision history Table 66. Document revision history Date Revision Changes 25-Mar-2014 1 Initial release. 27-Oct-2014 2 Updated DMIPS features in cover page and Section 2: Description Updated current consumption in Table 20: Current consumption in Sleep mode. Updated Table 25: Peripheral current consumption with new measured values. Updated Table 57: Maximum source impedance RAIN max adding note 2. 03-Feb-2015 3 Updated Section 7: Package information with new package device markings. Updated Figure 5: Memory map. 30-Apr-2015 4 Updated Section 7: Package information structure: Paragraph titles and paragraph heading level. Updated Table 62: LQFP64 10 x 10 mm, 64-pin low-profile quad flat package mechanical data. Updated Section 7: Package information for LQFP64 and UFQFPN48 package device markings, adding text for device orientation versus pin 1 identifier. Updated Table 17: Embedded internal reference voltage temperature coefficient at 100ppm/°C and table footnote 3: “guaranteed by design” changed by “guaranteed by characterization results”. Updated Table 60: Comparator 2 characteristics new maximum threshold voltage temperature coefficient at 100ppm/°C. 25-Apr-2016 5 Updated Table 40: ESD absolute maximum ratings CDM class. Updated all the notes, removing ‘not tested in production’. Updated Table 11: Voltage characteristics adding note about VREF- pin. Updated Table 3: Functionalities depending on the operating power supply range LSI and LSE functionalities putting “Y” in Standby mode. Removed note 1 below Figure 2: Clock tree. Updated Section 7: Package information replacing “Marking of engineering samples” by “device marking”. Updated Table 58: DAC characteristics resistive load. |
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