STM32L431 datasheet(179/200 Pages) STMICROELECTRONICS

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DocID028800 Rev 1

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STM32L431xx

Package information

197

Figure 52. UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid

array

package recommended footprint

Device marking

The following figure gives an example of topside marking orientation versus ball A1 identifier

location.

0.700

0.750

0.800

0.0276

0.0295

0.0315

ddd

0.080

0.0031

eee

0.150

0.0059

fff

0.050

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Table 93. UFBGA64 – 64-ball, 5 x 5 mm, 0.5 mm pitch ultra profile fine pitch ball grid array

package mechanical data (continued)

Symbol

millimeters

inches(1)

Min

Typ

Max

Min

Typ

Max

0.460

0.530

0.600

0.0181

0.0209

0.0236

Table 94. UFBGA64 recommended PCB design rules (0.5 mm pitch BGA)

Dimension

Recommended values

Pitch

0.5

Dpad

0.280 mm

Dsm

0.370 mm typ. (depends on the soldermask

registration tolerance)

Stencil opening

0.280 mm

Stencil thickness

Between 0.100 mm and 0.125 mm

Pad trace width

0.100 mm

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