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STM32F769AI Datasheet(PDF) 246 Page - STMicroelectronics |
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STM32F769AI Datasheet(HTML) 246 Page - STMicroelectronics |
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246 / 255 page ![]() Package information STM32F765xx STM32F767xx STM32F768Ax STM32F769xx 246/255 DocID029041 Rev 4 Figure 99. UFBGA176+25, 10 x 10 mm x 0.65 mm, ultra fine-pitch ball grid array package recommended footprint Table 132. UFBGA176+25 recommended PCB design rules (0.65 mm pitch BGA) Dimension Recommended values Pitch 0.65 mm Dpad 0.300 mm Dsm 0.400 mm typ. (depends on the soldermask reg- istration tolerance) Stencil opening 0.300 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm |
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