STM32L443CC datasheet(182/207 Pages) STMICROELECTRONICS

182 / 207 page

Package information

STM32L443CC STM32L443RC STM32L443VC

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DocID028739 Rev 2

Figure 45. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid

array

package recommended footprint

Device marking

The following figure gives an example of topside marking orientation versus ball A1 identifier

location.

0.500

0.0197

0.700

0.750

0.800

0.0276

0.0295

0.0315

ddd

0.100

0.0039

eee

0.150

0.0059

fff

0.050

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Table 92. UFBGA100 recommended PCB design rules (0.5 mm pitch BGA)

Dimension

Recommended values

Pitch

0.5

Dpad

0.280 mm

Dsm

0.370 mm typ. (depends on the soldermask

registration tolerance)

Stencil opening

0.280 mm

Stencil thickness

Between 0.100 mm and 0.125 mm

Table 91. UFBGA100 - 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra fine pitch ball grid array

package mechanical data (continued)

Symbol

millimeters

inches(1)

Min.

Typ.

Max.

Min.

Typ.

Max.

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