The part number **0603CS-R25XGLU** refers to a high-frequency, wire-wound ceramic core chip inductor manufactured by **Coilcraft**. This specific series is widely used in RF (Radio Frequency) applications due to its high Q factors and tight tolerances. --- ### 1. Part Number Breakdown Understanding the alphanumeric code helps identify the component's specifications: | Segment | Value | Meaning | | :--- | :--- | :--- | | **0603** | Size | 0603 Package (approx. 1.6 x 0.8 mm) | | **CS** | Series | Wire-wound ceramic core inductor | | **R25** | Inductance | 250 nH (R denotes the decimal point in µH: 0.25 µH) | | **X** | Tolerance | ±5% (Standard for this series) | | **G** | Termination | Gold over nickel (typically for specialized soldering or wire bonding) | | **L** | Testing | Standard testing/screening | | **U** | Packaging | 7″ Tape & reel packaging | --- ### 2. Technical Specifications Below are the typical electrical characteristics for this specific part: | Parameter | Specification | | :--- | :--- | | **Inductance** | 250 nH | | **Tolerance** | ±5% | | **Quality Factor (Q min)** | 33 (at 100 MHz) | | **Self Resonant Frequency (SRF)** | 1100 MHz (Typical) | | **DC Resistance (DCR Max)** | 1.15 Ohms | | **Maximum DC Current (Irms)** | 350 mA | | **Operating Temperature** | -40°C to +125°C | --- ### 3. Key Features & Applications #### Features * **Wire-Wound Construction:** Provides much higher Q (Quality) factors and current handling compared to multilayer chip inductors. * **Ceramic Core:** Ensures exceptional thermal stability and a high self-resonant frequency. * **Miniature Footprint:** The 0603 size is ideal for high-density PCB layouts. #### Applications * **RF Impedance Matching:** Used in the front-end circuits of wireless devices. * **Filter Circuits:** Low-pass, high-pass, and band-pass filters for signal processing. * **Oscillators:** Critical for frequency stability in VCO (Voltage Controlled Oscillator) circuits. * **Bluetooth/Wi-Fi Modules:** Essential for mobile communication hardware. --- ### 4. Handling and Soldering Because this part uses a **Gold (G)** termination, it is often selected for specific industrial or military applications where gold-plated pads are required to prevent oxidation or to facilitate specific soldering alloys. * **Soldering:** Compatible with reflow soldering profiles. * **Moisture Sensitivity:** Typically MSL 1 (Unlimited floor life).