Electronic Components Datasheet Search
  New Zealand  ▼
ALLDATASHEET.CO.NZ

X  

  • 1008CP-R33

  • AI
    The **1008CP-R33** is a specific part number for a surface-mount (SMD) wire-wound chip inductor. These components are primarily used in high-frequency RF (Radio Frequency) circuits. Below is a detailed breakdown of its technical specifications and characteristics. --- ### 1. Part Number Breakdown Inductor part numbers are typically coded to describe their physical size and electrical properties. | Segment | Meaning | Description | | :--- | :--- | :--- | | **1008** | Case Size | Dimensions are approx. 0.10 x 0.08 inches (2.5 x 2.0 mm). | | **CP** | Series Type | Often denotes a standard high-performance wire-wound series. | | **R33** | Inductance Value | "R" acts as a decimal point. **0.33 µH** (or 330 nH). | --- ### 2. Technical Specifications While exact specs can vary slightly by manufacturer (e.g., Coilcraft, Gowanda), the standard parameters for a 0.33 µH 1008 inductor are: * **Inductance:** 330 nH (0.33 µH). * **Tolerance:** Typically ±5% (J) or ±10% (K). * **Quality Factor (Q):** High Q (usually >45 at 100 MHz), ensuring low signal loss. * **Self-Resonant Frequency (SRF):** Usually around 500–600 MHz. * **DC Resistance (DCR):** Low resistance (typically < 0.60 Ohms) to minimize heat and power loss. * **Rated Current:** Generally handles between 300mA to 600mA depending on the specific build. --- ### 3. Construction and Features * **Wire-Wound Core:** Uses a ceramic or ferrite core wrapped with copper wire. This construction allows for much higher "Q" factors and better current handling than multilayer chip inductors. * **Ceramic Body:** Most 1008CP models use a ceramic body, which provides excellent thermal stability and very high SRF. * **Surface Mount (SMD):** Designed for automated "pick and place" assembly on PCBs. --- ### 4. Common Applications Due to its high resonance and stability, the 1008CP-R33 is found in: 1. **RF Filters:** Used in band-pass or low-pass filters for wireless communication. 2. **Impedance Matching:** Tuning antenna circuits to ensure maximum power transfer. 3. **Oscillators:** Providing stable inductance for frequency generation. 4. **Telecommunications:** Used in Bluetooth, Wi-Fi modules, and GPS receivers. ---
    ✨ Follow-up Questions
    • ⤷What is the difference between a wire-wound and a multilayer chip inductor?
    • ⤷ How does the 'Q factor' affect RF circuit performance?
    • ⤷ Which manufacturers produce the 1008CP series?