The **3D5-SBC-RPL** is a high-performance Single Board Computer (SBC) designed by SECO, built around the **13th Generation Intel® Core™ processors** (formerly Raptor Lake-P). It follows the 3.5-inch form factor, making it ideal for industrial automation, edge computing, and high-end digital signage. --- ## 1. Core Processing Specifications The board leverages Intel's hybrid architecture, combining Performance-cores (P-cores) and Efficient-cores (E-cores). | Component | Specification | | :--- | :--- | | **Processor** | Intel® Core™ i7 / i5 / i3 / Celeron® (Raptor Lake-P) | | **Graphics** | Integrated Intel® Iris® Xe Graphics (up to 96 EUs) | | **Memory** | 2x DDR5-4800 SO-DIMM slots (up to 64GB total) | | **TPM** | Integrated TPM 2.0 for hardware-based security | --- ## 2. Connectivity and I/O Interface The 3D5-SBC-RPL is densely packed with high-speed interfaces to handle multiple peripheral connections simultaneously. ### Networking & Wireless * **Ethernet:** Dual 2.5GbE LAN ports (typically Intel® i226 series) for high-speed wired networking. * **Expansion:** M.2 Key E slot for Wi-Fi/Bluetooth modules. ### Video Output The board can support up to four independent displays through: * 2x DisplayPort 1.4 (on Type-C or dedicated connectors). * 1x HDMI 2.0b. * 1x eDP (Embedded DisplayPort) or LVDS for internal panel integration. ### USB & Serial * **USB:** Multiple USB 3.2 Gen 2 (10Gbps) ports and USB 2.0 headers. * **Serial:** Support for RS-232, RS-422, and RS-485 protocols via internal headers. --- ## 3. Storage and Expansion Slots The architecture provides significant bandwidth for NVMe storage and cellular connectivity. | Slot Type | Usage | | :--- | :--- | | **M.2 Key M** | Support for NVMe SSDs (PCIe Gen4 x4) | | **M.2 Key B** | Support for 4G/5G Modems or SATA SSDs | | **SATA** | 1x SATA Gen 3 connector for traditional hard drives | --- ## 4. Power and Thermal Design * **Power Input:** Wide range input, typically **+12V to +24V DC**. * **Form Factor:** Standard 3.5" (146 x 102 mm). * **Cooling:** Available in both active (fan) and passive (heatsink) configurations depending on the TDP of the chosen processor (15W - 28W base power). --- ## 5. Key Electronic Advantages 1. **DDR5 Support:** Provides significantly higher memory bandwidth compared to previous DDR4 models, crucial for AI at the edge. 2. **PCIe Gen4:** Enables ultra-fast data transfer for modern NVMe storage. 3. **Industrial Grade:** Designed for 24/7 operation with long-term availability (7-10 years).