The **ATS-04C-112-C3-R1** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components like CPUs, GPUs, and power transistors. ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 26.38°C/W (Natural Convection) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### Key Electronic & Mechanical Features #### 1. Thermal Management Efficiency The unit is designed to dissipate heat away from integrated circuits (ICs). The **Blue Anodized** finish is not just for aesthetics; it increases surface emissivity, which helps in radiating heat away more effectively compared to bare aluminum. #### 2. Attachment Mechanism (Push-Pin) This specific model uses a **push-pin and spring** assembly. This is preferred in electronics for: * **Constant Pressure:** The spring ensures the heat sink maintains firm, even contact with the chip surface, preventing air gaps. * **Secure Mounting:** It provides a more robust mechanical connection than adhesive tapes, especially in high-vibration environments. #### 3. Pre-applied T412 TIM The "C3" in the part number indicates it comes with **T412 Thermal Interface Material**. * This is a "Phase Change" or high-performance pad that fills microscopic imperfections between the heat sink and the electronic component. * It eliminates the need for manual application of thermal grease during assembly. #### 4. Fin Design The **Straight Fin** geometry is optimized for "impingement" or "steady-state" airflow. It is most effective when there is a fan nearby or a clear path for air to move through the fins via convection. --- ### Use Cases * **Embedded Systems:** Cooling microprocessors in industrial PCs. * **Networking:** Regulating temperatures of high-speed switch chips. * **Power Supplies:** Managing thermal loads on MOSFETs or voltage regulators.