The **ATS-04F-72-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-04F-72-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Engineering Features #### A. Fin Geometry The "Straight Fin" design is optimized for **forced-air cooling** (airflow from a fan). The spacing between the fins is engineered to provide a low pressure drop while maximizing the surface area for heat exchange. #### B. Attachment System (Push-Pin & Spring) Unlike adhesive-based heat sinks, this model uses a mechanical mounting system: * **Push-Pins:** Ensure a secure fit into pre-drilled holes on the PCB. * **Compression Springs:** These provide consistent "Normal Force," ensuring that the heat sink remains in firm contact with the component even under mechanical shock or vibration. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a phase-change or high-performance pad that fills microscopic air gaps between the component surface and the heat sink base, significantly reducing thermal resistance. --- ### 3. Thermal Performance Indicators Thermal resistance is measured in °C/W (Degrees Celsius per Watt). The lower the value, the better the cooling: * **@1.0 m/s (200 LFM):** ~5.11 °C/W * **@2.0 m/s (400 LFM):** ~3.56 °C/W * **@3.0 m/s (600 LFM):** ~3.00 °C/W --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** High-speed routers and switches. * **Power Supplies:** Cooling MOSFETs or power regulators.