The **ATS-04H-33-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or high-power transistors. --- ## Technical Specifications The following table highlights the primary mechanical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 35mm x 35mm x 20mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 17.42°C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## Key Electronic/Thermal Features ### 1. Fin Design This part utilizes **cross-cut fins**, which are designed to improve heat dissipation in environments where the airflow direction might be inconsistent. This multi-directional flow capability makes it more efficient than standard straight-fin heat sinks. ### 2. pushPIN™ Attachment System The "04H" in the part number indicates a specific push-pin and spring mechanism. This provides: * **Constant Pressure:** Ensures the heat sink is firmly pressed against the chip for maximum thermal transfer. * **Easy Installation:** Simplifies the assembly process on the Printed Circuit Board (PCB) without the need for complex mounting hardware. ### 3. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**, a high-performance phase-change material. This fills the microscopic air gaps between the heat sink base and the electronic component, significantly reducing thermal resistance. --- ## Part Number Breakdown (Nomenclature) Understanding the alphanumeric code helps identify the specific variant: * **ATS**: Advanced Thermal Solutions (Manufacturer). * **04H**: Indicates the attachment style and height (High-performance push-pin). * **33**: Refers to the specific length/width footprint (35mm). * **C2**: Refers to the Aluminum material and Blue Anodized finish. * **R0**: Indicates the specific revision or packaging type. --- ## Applications * **Embedded Systems:** Cools processors in compact industrial PCs. * **Networking:** Used on switches and routers for ASICs. * **Power Electronics:** Dissipates heat from Voltage Regulator Modules (VRMs).