The **ATS-04H-34-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal properties. | Specification | Details | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 14.33°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 30mm | | **Fin Type** | Fine Pitch (High Surface Area) | --- ### 2. Key Features * **pushPIN™ Attachment:** This system features a pre-assembled push-pin and spring mechanism. It provides consistent pressure to ensure optimal thermal contact between the heat sink and the component. * **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides increased corrosion resistance and slightly improves radiative heat transfer. * **High Aspect Ratio:** The "34" series design utilizes a high fin density, which maximizes surface area for cooling in environments with forced airflow. * **Thermal Interface Material (TIM):** This specific model typically comes with a pre-applied thermal interface (T766), which fills microscopic air gaps between the heat sink and the chip. --- ### 3. Application Use Cases This part is typically found in the following electronic systems: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** For industrial PCs where space is limited but thermal output is high. 3. **Power Electronics:** Managing heat for voltage regulators or power converters. --- ### 4. Dimensional Diagram (Approximate) ```text 35.00 mm (Length) ___________________ | | | ||||||||||||| | 35.00 mm | ||||||||||||| | (Width) |___________________| | | |___| 30.00 mm (Height) ```