The **ATS-04H-80-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. These components are critical for preventing semiconductor failure by dissipating heat from integrated circuits (ICs). --- ## 🛠️ Technical Specifications Below is a breakdown of the physical and thermal characteristics of this specific model: | Attribute | Specification | | :--- | :--- | | **Product Type** | Heatsink (Push-Pin Mount) | | **Dimensions** | 30mm x 30mm x 25mm | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Fin Style** | Straight (High-density) | | **Thermal Resistance** | ~7.03°C/W (Unducted Flow @ 200 LFM) | | **Attachment Method** | Plastic Push-Pin with Brass Spring | --- ## 🔍 Key Electronic Components & Features ### 1. The Heat Dissipation Geometry The "04H" series indicates a specific fin density designed for optimized airflow. The straight-fin design is ideal for systems with a defined directional airflow (like a server chassis or high-speed cooling fan). ### 2. Attachment Mechanism (Push-Pin & Spring) Unlike adhesive-based heatsinks, the **ATS-04H-80-C2-R0** uses a mechanical attachment system: * **Push-Pins:** These provide a secure connection to the PCB via pre-drilled holes. * **Springs:** The brass springs ensure constant, uniform pressure on the electronic component, which improves the thermal interface and prevents the heatsink from shifting during vibration. ### 3. Thermal Interface Material (TIM) This part number typically comes with **T766** pre-applied. In electronics, the TIM is crucial because it fills microscopic air gaps between the chip (CPU/FPGA) and the aluminum base, significantly reducing thermal resistance. ### 4. Material and Finish * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** Aside from aesthetics, the anodized layer provides electrical insulation and improves corrosion resistance. --- ## 💡 Typical Applications This component is commonly found protecting the following electronic parts: * **FPGAs & ASICs:** High-speed processing units that generate localized heat. * **Power Modules:** Voltage regulators that require heat dissipation to maintain efficiency. * **Network Switches:** Used in telecom equipment where reliability is paramount. ---