The **ATS-04H-99-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** from Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or power transistors. ### Technical Specifications Below are the primary technical parameters for this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 11.51°C/W (at 100 LFM) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 20mm | | **Fin Style** | Cross-Cut (Pin Fin) | --- ### Core Components and Design #### 1. Pin-Fin Geometry Unlike traditional straight-fin heat sinks, the "Cross-Cut" or Pin-Fin design allows for omnidirectional airflow. This is critical in electronics where the direction of the cooling fan's exhaust might not be perfectly aligned with the fins. It increases the surface area for heat exchange. #### 2. pushPIN™ Attachment System The part number signifies it uses a specialized attachment mechanism: * **Push-Pins:** Brass pins with a pre-assembled spring. * **Compression Spring:** Provides a precise "Firm Attachment" force, ensuring the heat sink maintains constant contact with the electronic component. * **Installation:** Requires pre-drilled holes in the Printed Circuit Board (PCB). #### 3. Thermal Interface Material (TIM) The "R0" at the end of the part number typically indicates that the unit comes with **T766 phase change material** or a similar high-performance thermal pad pre-applied to the base. This fills microscopic air gaps between the chip and the heat sink. --- ### Thermal Performance Overview Performance is measured by how much the temperature rises per watt of power generated. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 11.51 | | 300 (1.5 m/s) | 3.33 | | 500 (2.5 m/s) | 2.04 | *Note: Higher airflow significantly increases the efficiency of this specific model.* --- ### Typical Applications * **Network Switches:** Cooling high-speed processing chips. * **Industrial Power Supplies:** Managing heat in MOSFETs or IGBTs. * **Embedded Systems:** Used on single-board computers where space is limited but thermal loads are high.