The **ATS-06B-01-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** series, which is designed for securing cooling components to PCBs with a standardized, reliable attachment mechanism. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Pitch (Mounting)** | 33mm x 33mm | | **Thermal Resistance (Unducted)** | 21.90 °C/W @ 100 LFM | | **Spring Type** | ATS-PP-02 | --- ### 2. Breakdown of the Part Number Understanding the nomenclature helps identify the specific variants of this electronic cooling part: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **06**: Series/Design type. * **B**: Material/Base configuration. * **01**: Specific fin pattern or height variation. * **C2**: Thermal Interface Material (TIM) type (typically **T766** phase-change material). * **R0**: RoHS compliance and revision status. --- ### 3. Key Electronic Cooling Features #### Thermal Interface Material (TIM) The "C2" suffix indicates that this part comes pre-applied with **ATS-T766** thermal grease or phase-change material. This ensures optimal heat transfer from the electronic component (CPU, FPGA, or MOSFET) to the aluminum heat sink base by filling microscopic air gaps. #### pushPIN™ Attachment Instead of using messy adhesives or weak clips, this part uses a precision spring-loaded pin system. * **Constant Pressure:** Ensures the heat sink remains flat against the component. * **Reliability:** Resistant to shock and vibration, which is critical for industrial or automotive electronics. * **Ease of Assembly:** Features pre-drilled holes for rapid installation on the PCB. #### Heat Dissipation Performance The sink is designed for a balance between low profile (10mm height) and surface area. It is most effective in environments with **forced air flow**. At higher air velocities (e.g., 500 LFM), the thermal resistance drops significantly (down to approximately 3.90 °C/W). --- ### 4. Applications * **Embedded Systems:** For cooling SoCs and processors in tight enclosures. * **Power Electronics:** Dissipating heat from high-speed transistors. * **Telecommunications:** Cooling chips on network switch line cards.