The **ATS-06B-01-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the "push-pin" attachment series designed for cooling semiconductor components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Plastic/Brass) | | **Heat Sink Type** | Straight Fin | | **Base Dimensions** | 40mm x 40mm | | **Height** | 10mm | | **Thermal Resistance** | 22.05 °C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material** | T412 (Double-Sided Thermal Tape) | --- ### 2. Functional Components This part is not an "active" electronic component (like a transistor) but a "passive" mechanical component essential for electronic reliability. #### A. The Heat Sink Body * **Fin Design:** It utilizes a high-density straight fin pattern. This increases the surface area exposed to air, allowing for efficient heat dissipation from the PCB component to the ambient environment. * **Material Choice:** Aluminum is used for its high thermal conductivity and lightweight properties. The **Blue Anodized** coating protects against corrosion and improves emissivity. #### B. The Push-Pin Attachment * This model uses a specialized push-pin mechanism. This provides a secure, vibration-resistant mount to the PCB compared to standard adhesive methods. * The pins are spring-loaded to ensure constant downward pressure, optimizing the contact between the heat sink and the chip. #### C. Thermal Interface Material (TIM) * The "C3" in the part number often indicates a specific pre-applied **Thermal Interface Material**. * The TIM fills microscopic air gaps between the semiconductor surface and the heat sink base, significantly reducing thermal impedance. --- ### 3. Typical Applications The ATS-06B-01-C3-R0 is commonly used to cool the following electronic parts: * **BGA (Ball Grid Array) Packages:** High-speed processors and chipsets. * **ASICs:** Application-specific integrated circuits in networking hardware. * **FPGAs:** Field Programmable Gate Arrays that generate significant heat during operation. --- ### 4. Thermal Performance Comparison Thermal resistance varies based on airflow (LFM - Linear Feet per Minute): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 22.05 | | 400 | 2.0 | 5.91 | | 600 | 3.0 | 4.07 |