The **ATS-06B-91-C3-R0** is a high-performance electronic thermal management component. Specifically, it is an aluminum heat sink designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The part number follows the standard Advanced Thermal Solutions (ATS) naming convention. Below are the primary specifications: | Parameter | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum (Al) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight Fin | | **Dimensions** | 40mm x 40mm x 10mm | | **Thermal Resistance** | 22.04 °C/W (@ 100 LFM) | | **Color/Finish** | Blue Anodized | | **Hardware included** | Spring, Brass Pin | --- ### 2. Physical Design & Features This part is engineered for compact electronic environments where space is limited but high thermal conductivity is required. * **pushPIN™ Attachment:** Unlike adhesive-based heat sinks, this uses a mechanical push-pin system. This ensures a consistent, pre-measured pressure (load) on the processor, which optimizes thermal interface material (TIM) performance. * **Pre-Drilled Holes:** The heat sink comes with pre-drilled holes to match specific PCB layouts (33mm hole spacing for this series). * **Material properties:** The aluminum construction is lightweight and provides excellent heat dissipation, while the **Blue Anodized** finish prevents corrosion and increases emissivity. --- ### 3. Performance Data (Airflow) The effectiveness of the ATS-06B-91-C3-R0 depends heavily on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 22.04 | | 300 (1.5 m/s) | 10.33 | | 500 (2.5 m/s) | 7.21 | | 700 (3.5 m/s) | 6.00 | --- ### 4. Typical Applications This component is commonly found in the following electronic hardware: * **Networking Equipment:** Routers, switches, and bridges. * **Embedded Systems:** Industrial PCs and IoT gateways. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Microprocessors/BGA:** Cooling small BGAs or FPGAs.