The **ATS-06D-07-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. These parts are critical for maintaining the operational temperature of integrated circuits (ICs), such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-06D-07-C2-R0 | | **Heat Sink Type** | Push-Pin Heat Sink | | **Attachment Method** | Push-Pin with Spring (Brass) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | ~17.00° C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The design is optimized for a square footprint, common in small-form-factor PCB layouts. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 12.70 mm * **Pitch (Fin Spacing):** Fine Pitch design for maximum surface area. --- ### 3. Electronic Design Features #### A. Fin Geometry (Straight Fin) The **straight-fin** design allows for efficient airflow across the surface. This is particularly effective in systems with forced-air cooling (fans), as it minimizes pressure drop while maximizing heat dissipation from the electronic component to the ambient air. #### B. Push-Pin Attachment Mechanism Instead of using adhesive tapes which can degrade over time, this part uses a mechanical **push-pin and spring** system: 1. **Reliability:** Provides consistent downward pressure for optimal contact with the chip. 2. **Ease of Assembly:** Can be installed manually or via automated systems into pre-drilled holes in the PCB. 3. **Vibration Resistance:** The spring tension ensures the heatsink remains seated even in high-vibration environments. #### C. Thermal Interface Material (T766) The "C2" designation typically refers to the inclusion of **T766 phase-change material**. This is an "electronic-grade" interface that fills microscopic air gaps between the IC and the heatsink base, significantly lowering thermal impedance compared to air. --- ### 4. Application Use-Cases This specific heatsink is generally found in: * **Telecommunications:** Network switches and routers. * **Embedded Systems:** Industrial PC boards. * **Power Electronics:** Voltage regulator modules (VRMs).