The **ATS-06F-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the "pushPIN™" series, designed for efficient cooling of semiconductors and PCBs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | Details | | :--- | :--- | :--- | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Increases surface emissivity and corrosion resistance | | **Fin Type** | Cross-Cut | Enhances airflow from multiple directions | | **Attachment** | pushPIN™ | Uses a spring-loaded mechanism for consistent pressure | | **Thermal Resistance** | 17.42 °C/W (Unducted) | Performance at 100 LFM (Linear Feet per Minute) | | **Dimensions (L x W)** | 35.00 x 35.00 mm | Footprint size | | **Height** | 20.00 mm | Vertical clearance required | --- ### 2. Key Electronic Features #### A. Thermal Interface Material (TIM) This specific part number comes pre-applied with **T766** thermal material. This is a high-performance phase-change material that fills microscopic air gaps between the electronic component (CPU, GPU, or MOSFET) and the heat sink to maximize heat transfer. #### B. Attachment Mechanism (pushPIN™) The "pushPIN" system consists of a brass or plastic pin and a stainless steel spring. * **Benefits:** It provides a precise "compression force" (calculated at the factory) to ensure the heat sink remains in contact with the chip without damaging the PCB. * **Hardware:** It typically uses a 4.3mm hole size for mounting. #### C. Cross-Cut Fin Design Unlike straight-fin heat sinks, the cross-cut design allows air to enter the fin array from different angles. This makes it ideal for electronics where the cooling fan might not be perfectly aligned with the heat sink. --- ### 3. Applications The ATS-06F-33-C2-R0 is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Power Supplies:** Managing heat in voltage regulators and power transistors. 3. **Embedded Systems:** For industrial computers where space is limited but heat density is high.