The **ATS-06F-92-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" thermal management series, designed to cool electronic components like CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications Below are the primary electronic and physical specifications for this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-06F-92-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 16.48°C/W (at 100 LFM) | | **Fin Pattern** | Straight | | **Fin Pitch** | Fine-Pitch | --- ### 2. Physical Design and Construction The design of the ATS-06F-92-C2-R0 focuses on maximizing surface area while maintaining a low profile for space-constrained PCB layouts. * **Heat Sink Material:** Extruded aluminum provides a lightweight solution with high thermal conductivity. * **Surface Finish:** The **Blue Anodized** finish is not just aesthetic; it protects the aluminum from corrosion and increases emissivity for better radiative cooling. * **Fin Geometry:** The "Fine-Pitch" straight fin design is optimized for environments where there is forced air cooling (fans). --- ### 3. Mounting System (pushPIN™) The "R0" designation refers to the specific mounting hardware included with the heat sink. * **Mechanism:** Uses a spring-loaded push-pin system. * **Consistency:** The springs provide a precise, pre-set pressure (Load) on the electronic component, ensuring optimal thermal contact without risking damage to the silicon or the PCB. * **Hardware:** Usually consists of a brass or plastic pin with a stainless steel compression spring. --- ### 4. Thermal Performance Data Performance varies based on the Airflow (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 16.48 | | **200** | 6.17 | | **300** | 3.46 | | **400** | 2.51 | | **500** | 1.99 | --- ### 5. Application Use Cases This specific heat sink is typically found in: 1. **Network Switches/Routers:** Cooling high-speed processing chipsets. 2. **Embedded Systems:** Industrial PCs where vertical space is limited to 15mm. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.