The **ATS-07A-133-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is a passive electronic component designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or power transistors, to ensure they remain within safe operating temperatures. Below is a detailed breakdown of its specifications and electronic integration characteristics. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Thermal Resistance (Flowing)** | 7.42°C/W @ 100 LFM | | **Thermal Resistance (Static)** | 2.22°C/W (at high airflow) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions** | 70mm x 70mm x 10mm | --- ### 2. Physical Design Features * **Heat Sink Profile:** This is a "Low Profile" heat sink (only 10mm high), making it ideal for compact electronic enclosures or 1U server chassis. * **Fin Style:** It utilizes a **Straight Fin** design, which provides a large surface area for air to pass through, optimized for forced-air cooling (fan-driven). * **Blue Anodized Finish:** The surface treatment is not just aesthetic; anodizing increases surface emissivity and provides a layer of protection against environmental corrosion. --- ### 3. Mounting and Electronic Integration The part number indicates a specific mounting mechanism and thermal interface: 1. **Push-Pin Attachment:** The "ATS-07" series uses a push-pin and spring mechanism. This ensures consistent pressure on the electronic component, which is critical for maximizing thermal transfer. 2. **Thermal Interface Material (TIM):** This model typically comes with **T412** phase-change material or high-performance thermal tape pre-applied to the base. This fills the microscopic air gaps between the heat sink and the chip. 3. **Hole Pattern:** It requires specific pre-drilled holes in the PCB (Printed Circuit Board) to lock the pins in place. --- ### 4. Thermal Performance Comparison Thermal resistance ($\theta$) is measured in degrees Celsius per Watt (°C/W). A lower number means better cooling. | Air Velocity (LFM) | 100 | 200 | 300 | 400 | 500 | | :--- | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 7.42 | 3.38 | 2.42 | 2.01 | 1.77 | --- ### 5. Summary of Part Number Suffixes * **C2:** Refers to the thermal performance class and specific attachment kit (usually plastic push-pins). * **R0:** Indicates the revision status and that the product is RoHS (Restriction of Hazardous Substances) compliant.