The **ATS-07D-41-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance **Heat Sink** designed for cooling electronic components such as CPUs, GPUs, or high-power transistors. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the device: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 25mm | | **Thermal Resistance** | 10.02 °C/W (Unducted Flow @ 100 LFM) | | **Attachment Type** | Push-Pin (Stainless Steel / Plastic) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Electronic & Mechanical Design Parts ### A. The Heat Sink Body (Fins) The "41" in the part number indicates a specific fin pattern. This model typically features **straight fins** or a **cross-cut** design. * **Purpose:** To increase the surface area in contact with the air. * **Material:** Made of aluminum for high thermal conductivity and low weight. ### B. The Attachment Mechanism (pushPIN™) Unlike adhesive-based heat sinks, this uses a **Push-Pin** system. * **Hardware:** It includes two stainless steel or plastic pins and a high-performance compression spring. * **Benefit:** Provides consistent pressure (force) against the electronic component, ensuring optimal thermal contact and preventing the sink from shifting due to vibration. ### C. Thermal Interface Material (TIM) The base of the heat sink comes pre-applied with **T766 phase-change material**. * **Electronic Role:** It fills microscopic air gaps between the heat sink and the semiconductor package. * **Impact:** Significantly lowers the contact resistance, allowing heat to flow efficiently from the silicon die to the aluminum fins. ### D. Anodized Finish The **Blue Anodized** coating is not just for aesthetics. * **Protection:** It provides corrosion and wear resistance. * **Performance:** Anodizing slightly increases the emissivity of the surface, aiding in heat dissipation through radiation. --- ## 3. Typical Applications This component is used to manage the thermal profile of: * **ASICs and FPGAs:** Used in networking gear where airflow is controlled. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. * **Embedded Systems:** Industrial PCs where mechanical stability is required.