The **ATS-07F-147-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and power transistors. ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Part Number** | ATS-07F-147-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (with compression springs) | | **Thermal Resistance** | 13.52°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | --- ### Key Electronic & Mechanical Features #### 1. Thermal Management Performance The primary role of this part is to dissipate heat from integrated circuits (ICs). Its thermal performance varies based on airflow (measured in Linear Feet per Minute - LFM): * **Low Airflow (100 LFM):** 13.52 °C/W * **High Airflow (700 LFM):** 3.16 °C/W * **Effectiveness:** The "straight fin" design allows for low pressure drop and is ideal for systems with high-velocity cooling fans. #### 2. Material and Coating * **Aluminum Construction:** Offers a high thermal conductivity-to-weight ratio, ensuring heat is pulled away from the silicon die quickly. * **Blue Anodized Finish:** This is not just for aesthetics; anodizing increases surface emissivity (the ability to radiate heat) and provides electrical insulation and corrosion resistance. #### 3. Attachment Mechanism (pushPIN™) This component uses a specialized spring-loaded push-pin system. This is critical for electronics because: * **Consistent Pressure:** The springs ensure a precise amount of force is applied to the chip, optimizing the Thermal Interface Material (TIM) performance without cracking the delicate die. * **Secure Mounting:** The pins lock into pre-drilled holes on the PCB (Printed Circuit Board). #### 4. Thermal Interface Material (TIM) The "C2" in the part number indicates that this heat sink comes with **T766** phase-change material or high-performance grease pre-applied to the base. This eliminates the need for manual application during assembly. --- ### Common Applications * **FPGA & ASIC Cooling:** Used on high-speed programmable logic devices. * **Power Supplies:** Cooling voltage regulators and MOSFETs. * **Embedded Systems:** Industrial PCs where space is limited (10mm low profile).