ATS-07F-53-C2-R0
AI

The **ATS-07F-53-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part number:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Thermal Resistance** | 8.57°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions (L x W)** | 35.00mm x 35.00mm |
| **Height** | 30.00mm |
| **Finish** | Blue Anodized |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Component Breakdown
#### A. The Fin Design (Cross-Cut)
The "53" in the part number indicates a specific fin pattern. This model typically features a **straight fin** or **cross-cut** design. Cross-cutting allows for "omni-directional" airflow, meaning it can dissipate heat effectively even if the air is not blowing perfectly parallel to the fins.
#### B. Push-Pin Attachment Mechanism
Instead of using messy adhesives or permanent solder, this part uses the **pushPIN™** system:
* **Compression Springs:** Provides consistent pressure to ensure maximum contact between the heat sink and the chip.
* **Plastic/Brass Pins:** Designed to fit into pre-drilled holes on a Printed Circuit Board (PCB).
#### C. Thermal Interface Material (TIM)
The unit comes with **T766** pre-applied to the base. This is a phase-change material or high-performance thermal grease that fills microscopic air gaps between the heat sink and the electronic component, significantly improving heat transfer.
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### 3. Application Use Cases
This specific heat sink is categorized as a "Medium" profile cooler (30mm height) and is commonly used in:
* **Telecommunications:** Network switches and routers.
* **Embedded Systems:** Industrial motherboards and controllers.
* **Power Supplies:** High-wattage DC-DC converters.
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### 4. Part Number Decoder
Understanding the "ATS-07F-53-C2-R0" syntax:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **07:** Series/Type.
* **F:** Fin pitch/style.
* **53:** Dimension/Layout code.
* **C2:** Material/Color (Aluminum / Blue Anodized).
* **R0:** Revision/Packaging code.
- ⤷
What is the difference between ducted and unducted thermal resistance for this part?
- ⤷ Are there alternative attachment methods if my PCB doesn't have push-pin holes?
- ⤷ How do I calculate if 8.57°C/W is sufficient for my specific chip's TDP?