The **ATS-07F-64-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Heat Sink Type** | Push-pin style (Straight Fin) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40mm x 40mm x 25mm | | **Attachment Method** | Plastic push-pins with steel springs | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Thermal Resistance** | 9.39°C/W @ 100 LFM (Linear Feet per Minute) | --- ### 2. Physical Design Features * **Fin Profile:** This model uses a **straight-fin** design. Straight fins are ideal for environments with high-velocity airflow from a cooling fan, as they provide low pressure drop and efficient heat transfer. * **Material and Coating:** It is made of Aluminum to balance weight and thermal conductivity. The **Blue Anodized** finish provides a layer of corrosion resistance and slightly improves radiative cooling. * **Push-Pin Attachment:** The "07F" series utilizes a spring-loaded push-pin system. This ensures consistent pressure across the chip surface, improving thermal contact while providing a secure mechanical fit to the PCB via pre-drilled holes. --- ### 3. Thermal Performance Comparison Thermal performance depends heavily on the airflow (LFM). Below is an estimated performance breakdown: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 9.39 | | 200 | 1.0 | 5.33 | | 300 | 1.5 | 4.30 | | 400 | 2.0 | 3.73 | --- ### 4. Component Application * **PCB Mounting:** Requires two holes in the PCB, typically spaced 33mm apart (check specific datasheet for exact pitch). * **Thermal Interface:** The unit comes with **T766** phase-change material. This eliminates the need for manual thermal paste application during assembly. * **Target Components:** Suitable for BGA (Ball Grid Array) packages where high heat dissipation is required in a 40mm footprint. ---