The **ATS-07F-77-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 9.30°C/W (at 200 LFM) | | **Dimensions (L x W)** | 25mm x 25mm | | **Height (Fin Height)** | 20mm | | **Mounting Type** | Push Pin (Brass) | | **Fin Style** | Cross-Cut (Omni-directional) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Features ### A. Cross-Cut Fin Design Unlike straight-fin heat sinks, the **cross-cut** design allows for airflow from any direction. This makes it highly efficient in crowded PCB environments where the direction of the cooling fan's airflow might be turbulent or angled. ### B. Push Pin Attachment Mechanism * **Ease of Assembly:** It uses a brass push pin with a built-in spring. This ensures a consistent and secure downward pressure on the electronic component. * **Reliability:** The spring-loaded mechanism compensates for thermal expansion and vibration, maintaining contact between the chip and the heat sink. ### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a phase-change material that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance compared to air. --- ## 3. Performance Summary The efficiency of this heat sink depends heavily on the airflow (Linear Feet per Minute - LFM): * **@ 200 LFM:** 9.30 °C/W * **@ 400 LFM:** 5.21 °C/W * **@ 600 LFM:** 4.19 °C/W *Note: A lower °C/W value indicates better heat dissipation performance.* --- ## 4. Application Use Cases 1. **Networking Hardware:** Switches and routers where internal airflow is often restricted. 2. **Embedded Systems:** Industrial PCs that operate in high-temperature environments. 3. **Power Supplies:** Cooling voltage regulators or power MOSFETs.