The **ATS-08B-05-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* It belongs to the **blueICE™** or **pushPIN™** series, designed for cooling integrated circuits (ICs) like CPUs, GPUs, or other high-heat surface-mount components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 8.84°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T412 (High-performance phase-change material) | --- ### 2. Key Component Features #### A. Attachment Mechanism: pushPIN™ Unlike adhesive-based heat sinks, the "pushPIN" system uses a flexible, spring-loaded mechanism. This ensures: * **Constant Pressure:** Maintains a secure interface between the heat sink and the chip for better heat transfer. * **Durability:** It is less likely to fall off due to vibration or thermal expansion compared to tape. #### B. Thermal Interface Material (T412) The part comes pre-applied with **T412**, a high-conductivity thermal pad. This eliminates the need for manual application of thermal paste and ensures consistent performance across manufacturing batches. #### C. Fin Design The **Straight Fin** geometry is optimized for "ducted" or "open" airflow environments. The 25mm height (the "05" in the part number) provides a larger surface area for convection cooling compared to low-profile alternatives. --- ### 3. Part Number Breakdown The nomenclature `ATS-08B-05-C3-R0` can be decoded as follows: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **08** | Specific Series / Mounting Pattern | | **B** | Version / Revision | | **05** | Height Code (25mm in this series) | | **C3** | Thermal Resistance/Material Grade | | **R0** | RoHS Compliant / Revision State | --- ### 4. Typical Applications * **Networking Gear:** Cooling ASICs in routers and switches. * **Industrial PCs:** Thermal management for embedded processors. * **Power Supplies:** Heat dissipation for high-voltage regulators.