ATS-08B-06-C3-R0
AI

The **ATS-08B-06-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs.
### 1. Technical Specifications
The following table highlights the core physical and thermal properties of the device:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 40mm x 40mm x 25mm |
| **Attachment Method** | pushPIN™ (Brass pins / Plastic pins) |
| **Thermal Resistance** | 2.11°C/W (at 200 LFM) |
| **Pressure Drop** | 0.16 in-H2O (at 200 LFM) |
| **Compliance** | RoHS / REACH |
---
### 2. Design and Engineering Features
* **maxiFLOW™ Fin Profile:** This heat sink features a unique "flared" fin design. This maximizes the surface area for radiant and convective cooling while maintaining low pressure drop, making it highly efficient in forced-air environments.
* **pushPIN™ Attachment:** The "R0" suffix indicates the inclusion of a specialized pushPIN™ system. This allows for tool-less installation and provides the necessary pressure to ensure optimal contact with the thermal interface material (TIM).
* **Thermal Interface Material (TIM):** It typically comes pre-applied with **T412**, a high-quality thermal tape or grease, ensuring a low-resistance thermal path between the chip and the aluminum body.
---
### 3. Usage Context
Electronic designers use the ATS-08B-06-C3-R0 when a standard square heat sink is insufficient for high-density boards. It is ideal for:
1. **Telecommunications:** High-speed routers and switches.
2. **Industrial PCs:** Compact systems requiring passive or active airflow cooling.
3. **Power Supplies:** Cooling MOSFETs or power regulators.
---
### 4. Part Number Breakdown
```text
ATS - 08 - B - 06 - C3 - R0
| | | | | |
| | | | | +-- Revision/Assembly Type
| | | | +------- Thermal Interface (T412)
| | | +------------ Height (25mm)
| | +----------------- Fin Pitch/Style
| +---------------------- Fin Layout Pattern
+---------------------------- Manufacturer (Advanced Thermal Solutions)
```
- ⤷What is the difference between pushPIN and adhesive mounting for this heat sink?
- ⤷ How do I calculate if the 2.11°C/W thermal resistance is sufficient for my component?
- ⤷ Are there copper versions of the maxiFLOW series available?