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  • ATS-08B-06-C3-R0

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    The **ATS-08B-06-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications The following table highlights the core physical and thermal properties of the device: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40mm x 40mm x 25mm | | **Attachment Method** | pushPIN™ (Brass pins / Plastic pins) | | **Thermal Resistance** | 2.11°C/W (at 200 LFM) | | **Pressure Drop** | 0.16 in-H2O (at 200 LFM) | | **Compliance** | RoHS / REACH | --- ### 2. Design and Engineering Features * **maxiFLOW™ Fin Profile:** This heat sink features a unique "flared" fin design. This maximizes the surface area for radiant and convective cooling while maintaining low pressure drop, making it highly efficient in forced-air environments. * **pushPIN™ Attachment:** The "R0" suffix indicates the inclusion of a specialized pushPIN™ system. This allows for tool-less installation and provides the necessary pressure to ensure optimal contact with the thermal interface material (TIM). * **Thermal Interface Material (TIM):** It typically comes pre-applied with **T412**, a high-quality thermal tape or grease, ensuring a low-resistance thermal path between the chip and the aluminum body. --- ### 3. Usage Context Electronic designers use the ATS-08B-06-C3-R0 when a standard square heat sink is insufficient for high-density boards. It is ideal for: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial PCs:** Compact systems requiring passive or active airflow cooling. 3. **Power Supplies:** Cooling MOSFETs or power regulators. --- ### 4. Part Number Breakdown ```text ATS - 08 - B - 06 - C3 - R0 | | | | | | | | | | | +-- Revision/Assembly Type | | | | +------- Thermal Interface (T412) | | | +------------ Height (25mm) | | +----------------- Fin Pitch/Style | +---------------------- Fin Layout Pattern +---------------------------- Manufacturer (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • What is the difference between pushPIN and adhesive mounting for this heat sink?
    • How do I calculate if the 2.11°C/W thermal resistance is sufficient for my component?
    • Are there copper versions of the maxiFLOW series available?