ATS-08B-75-C3-R0
AI

The **ATS-08B-75-C3-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series designed for cooling electronic components such as CPUs, GPUs, and high-power chipsets.
Below is a detailed breakdown of its specifications and electronic application characteristics.
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (High Performance) |
| **Fin Type** | straight-fin (Push-Pin) |
| **Thermal Resistance** | 15.28°C/W (Unducted @ 100 LFM) |
| **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 30.00mm |
| **Attachment Method** | Push-Pin (Brass, 10-pack or individual) |
| **Thermal Interface Material (TIM)** | T412 (Double-sided thermal tape) |
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### 2. Physical Design Features
* **Fin Style:** It utilizes a high-density vertical fin design. This maximizes the surface area for heat dissipation while maintaining a compact footprint (25mm x 25mm).
* **Height Profile:** At 30mm tall, it is considered a mid-to-high profile heat sink, requiring sufficient clearance within an electronic enclosure.
* **Finish:** Blue Anodized. Anodizing not only prevents corrosion but also slightly increases surface emissivity, which helps with radiative cooling.
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### 3. Application in Electronics
This component is used in electronic circuit design to manage the thermal load of semiconductors. Key use cases include:
1. **Component Protection:** Prevents thermal throttling or permanent damage to BGA (Ball Grid Array) components.
2. **Mechanical Stability:** The "Push-Pin" mechanism ensures a consistent downward pressure (clamping force) on the chip, which is more reliable than simple adhesive in high-vibration environments.
3. **Efficiency:** The pre-applied T412 thermal interface material ensures low contact resistance between the electronic package and the aluminum base.
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### 4. Part Number Breakdown (Nomenclature)
* **ATS:** Manufacturer prefix.
* **08:** Series designation.
* **B:** Material/Revision code.
* **75:** Specific geometry/Fin configuration.
* **C3:** Blue Anodized finish.
* **R0:** Compliance code (RoHS compliant).
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- ⤷
What are the airflow requirements to achieve optimal thermal resistance with this heat sink?
- ⤷ How does the T412 thermal interface material compare to phase-change materials?
- ⤷ Can this heat sink be used with customized mounting hardware instead of push-pins?