The **ATS-08D-07-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Attachment Method** | pushPIN™ (Plastic Pins & Springs) | | **Thermal Resistance (Unducted)** | 17.00 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 2.70 °C/W @ 100 LFM | | **Flow Direction** | XCUT (Omni-directional) | --- ### Key Electronic Components & Features #### 1. Heat Sink Body (The Fin Array) The "XCUT" design features a cross-cut fin pattern. Unlike straight-fin heat sinks, this allows air to flow from any direction, making it ideal for electronic enclosures where the direction of airflow from cooling fans might be turbulent or inconsistent. #### 2. Attachment Mechanism: pushPIN™ This part uses a specific mechanical system instead of thermal adhesive or screws: * **Plastic Push Pins:** These snap into pre-drilled holes on the Printed Circuit Board (PCB). * **Compression Springs:** These provide a precise "force" or pressure on the electronic chip, ensuring maximum contact and better heat transfer. #### 3. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal interface. * **T766 Phase Change Material:** This part comes pre-applied with a high-performance thermal pad. When the electronic part heats up, the material softens to fill microscopic gaps between the chip and the heat sink. #### 4. Material and Coating * **Aluminum:** Chosen for its high thermal conductivity and low weight. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves radiant heat emission. --- ### Application Usage This component is typically found in: * **Telecommunications:** Networking switches and routers. * **Industrial PC:** Embedded systems where height is restricted (12.7mm profile). * **Power Supplies:** Cooling MOSFETs or voltage regulators.