ATS-08F-142-C2-R0
AI

The **ATS-08F-142-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling electronic components such as CPUs, GPUs, or power modules.
---
## 1. Technical Specifications
The part number follows a specific nomenclature from the manufacturer, **Advanced Thermal Solutions (ATS)**.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. |
| **Series** | pushPIN™ HS |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Spring Loaded) |
| **Dimensions** | 30.00mm x 30.00mm x 15.00mm |
| **Thermal Resistance** | 4.85°C/W (at 100 LFM) |
| **Fin Style** | Fine Pitch (Square Pattern) |
---
## 2. Key Electronic Functions
### Thermal Dissipation
This part is a **passive cooler**. Its primary function is to increase the surface area of a heat-generating electronic component, allowing the surrounding air to carry heat away more efficiently.
### pushPIN™ Attachment System
Unlike adhesive-based heatsinks, the `C2-R0` version uses a mechanical **Push-Pin** system. This provides:
* **Constant Pressure:** Ensures the thermal interface material (TIM) is compressed evenly for maximum heat transfer.
* **Reliability:** Mechanical pins prevent the heatsink from shifting or falling off due to vibration or thermal cycling.
### Material Science
* **Aluminum Construction:** Offers a balance between thermal conductivity and lightweight properties.
* **Blue Anodized Coating:** Not only provides a professional aesthetic but also adds a layer of electrical insulation and corrosion resistance to the aluminum surface.
---
## 3. Comparison of Airflow Performance
The effectiveness of this heatsink varies based on the Linear Feet per Minute (LFM) of airflow provided by system fans.
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 4.85 |
| 200 (1.0 m/s) | 2.99 |
| 300 (1.5 m/s) | 2.56 |
| 400 (2.0 m/s) | 2.31 |
---
## 4. Part Number Breakdown
The suffix **C2-R0** provides specific details about the materials:
* **C2:** Indicates the use of a specific Thermal Interface Material (usually a pre-applied high-performance thermal pad).
* **R0:** Refers to the RoHS (Restriction of Hazardous Substances) compliance status, ensuring it is safe for global distribution.
- ⤷
What are the compatible hole patterns for the push-pin mounting on this heatsink?
- ⤷ Does this model come with pre-applied thermal interface material (TIM)?
- ⤷ What is the weight of the ATS-08F-142-C2-R0?