The part number **ATS-10F-63-C2-R0** refers to a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). This component belongs to the **pushPIN™** series, designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Pitch (Pattern)** | Square | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 12.32°C/W (at 100 LFM) | | **Flow Direction** | COARSE-PITCH (Straight fin) | --- ### 2. Detailed Component Breakdown #### A. Thermal Management (The Core) This heat sink is designed for **passive or active cooling** in electronic systems. - **Efficiency:** The 12.32°C/W rating means that for every Watt of power dissipated by the electronic chip, the temperature will rise by roughly 12.32 degrees Celsius above ambient air. - **Fin Profile:** It uses a "Coarse-Pitch" straight-fin design, which is optimized for systems with lower air pressure or larger air gaps. #### B. The pushPIN™ Attachment System The "10F" in the part number indicates the specific pushPIN™ hardware. This system replaces traditional adhesive tapes or thermal epoxy with a mechanical solution: - **Spring Mechanism:** Provides consistent pressure (Pre-assembled with a compression spring). - **Ease of Install:** Allows for quick mounting through pre-drilled holes in the PCB. #### C. Material and Coating - **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. - **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides increased surface area at a microscopic level and protects the aluminum from corrosion. --- ### 3. Applications This part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling of high-speed network switches. 2. **Computing:** Chipset cooling on motherboards or industrial PCs. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. ---