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  • ATS-11F-151-C2-R0

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    The **ATS-11F-151-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** line, designed for efficient thermal management of electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-11F-151-C2-R0 | | **Material** | Aluminum | | **Fin Type** | Straight | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flowing)** | 3.99°C/W @ 100 LFM | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm | | **Thermal Interface Material** | T766 (Pre-applied phase change material) | | **Finish** | Blue Anodized | --- ## 2. Key Component Analysis ### A. The Heat Sink Body The body is constructed from aluminum for high thermal conductivity and lightweight properties. The **Straight Fin** design is optimized for environments with high-velocity airflow, allowing air to pass through the channels and carry away heat efficiently. ### B. pushPIN™ Attachment System This part uses a specific pushPIN™ mechanism. This system replaces traditional adhesive or bolt-on methods: * **Ease of Install:** Uses a spring-loaded pin to snap into pre-drilled holes in the PCB. * **Constant Pressure:** The spring ensures consistent contact pressure between the heat sink and the component, which is critical for thermal transfer. ### C. Thermal Interface Material (TIM) The **C2** in the part number indicates the use of **T766** thermal material. This is a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink base, significantly reducing thermal resistance. --- ## 3. Physical Dimensions Understanding the footprint is vital for PCB layout and clearance planning. | Dimension | Value (mm) | | :--- | :--- | | **Width (A)** | 35.00 | | **Length (B)** | 35.00 | | **Height (C)** | 20.00 | | **Pitch (E)** | 40.00 (Hole spacing) | | **Pitch (F)** | 40.00 (Hole spacing) | --- ## 4. Ordering Code Breakdown * **ATS**: Manufacturer (Advanced Thermal Solutions). * **11**: Series (pushPIN™ Heat Sink). * **F**: Fine Pitch/Straight Fin geometry. * **151**: Specific dimensions/thermal profile. * **C2**: Material/Finish code (Blue Anodized + T766 TIM). * **R0**: RoHS Compliant.
    ✨ Follow-up Questions
    • ⤷ What is the hole diameter required on the PCB for the pushPIN attachment?
    • ⤷ How does the T766 thermal material compare to standard thermal grease?
    • ⤷ Can this heat sink be used in a passive cooling environment without fans?