The **ATS-12B-96-C2-R0** is a specific high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" heat sink series, designed specifically for cooling electronic integrated circuits (ICs) like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Thermal Resistance** | 1.17°C/W (@ 200 LFM) | | **Airflow Path** | High-performance MaxiFLOW™ spread fin | | **RoHS Status** | Compliant | --- ### 2. Breakdown of the Part Number The part number follows a specific coding convention used by Advanced Thermal Solutions: * **ATS:** Manufacturer prefix (Advanced Thermal Solutions). * **12B:** Refers to the specific series and mechanical design. * **96:** Refers to the specific footprint and internal dimensions code. * **C2:** Refers to the finish (Blue Anodized). * **R0:** Revision code (Standard production). --- ### 3. Key Electronic Functions While the heat sink itself is passive (it does not require power), it is critical for the survival of active electronic components: * **Heat Dissipation:** It increases the surface area of the heat source, allowing ambient air to carry away thermal energy generated by semiconductor switching. * **Thermal Interface:** It is typically paired with a **Thermal Interface Material (TIM)** or phase-change pad to fill microscopic air gaps between the chip and the aluminum. * **pushPIN™ Attachment:** This specific model uses a spring-loaded mechanism. This ensures constant, even pressure on the silicon die, which prevents mechanical stress while optimizing thermal conductivity. --- ### 4. Typical Applications This part is commonly found in high-density electronic environments: 1. **Networking Hardware:** High-speed routers and switches. 2. **Server Blades:** Where vertical clearance is limited but high airflow is present. 3. **Industrial Controls:** Cooling power modules that operate in high-temperature environments.