ATS-12B-97-C2-R0
AI

The **ATS-12B-97-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" line.
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### 1. Technical Specifications
This part is designed to dissipate heat from integrated circuits (ICs) and other electronic components.
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ |
| **Attachment Type** | Push-Pin (Spring-loaded) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 20.30°C/W (Unducted Flow @ 100 LFM) |
| **Base Dimension** | 45.00mm x 45.00mm |
| **Height** | 10.00mm |
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### 2. Design Characteristics
The part number can be broken down to understand its physical properties:
* **Heat Sink Profile:** It features a **Straight-Fin** design. This is ideal for applications where there is a consistent, directional airflow across the PCB.
* **Material Science:** The use of aluminum provides a balance between high thermal conductivity and low weight. The **Blue Anodized** finish increases the surface emissivity and protects the metal from corrosion.
* **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a high-performance thermal phase-change material that ensures a tight thermal bond between the chip and the sink.
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### 3. Mounting System (pushPIN™)
The "B" in the part number refers to the mounting hardware.
* **Push-Pins:** These are plastic or metal pins that snap into pre-drilled holes on the PCB.
* **Compression Springs:** Each pin includes a stainless steel spring that provides precise, uniform pressure (load) on the component. This prevents the heat sink from shifting and ensures optimal heat transfer.
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### 4. Thermal Performance Table
Performance varies based on air velocity (measured in Linear Feet per Minute - LFM):
| Velocity (LFM) | 100 (0.5m/s) | 300 (1.5m/s) | 500 (2.5m/s) | 700 (3.5m/s) |
| :--- | :--- | :--- | :--- | :--- |
| **Resistance (Unducted)** | 20.30 °C/W | 8.93 °C/W | 5.07 °C/W | 3.62 °C/W |
| **Resistance (Ducted)** | 5.84 °C/W | 3.70 °C/W | 2.93 °C/W | 2.52 °C/W |
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- ⤷What are the recommended PCB hole sizes for the pushPIN mounting system?
- ⤷ How does the T766 thermal interface material compare to standard thermal grease?
- ⤷ Can this heat sink be used for passive cooling without a fan?