The **ATS-13F-99-C1-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications This part belongs to the **pushPIN™** heat sink assembly series. Below are the primary specifications: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | 11.49°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 45mm x 45mm x 20mm | | **Fin Style** | Fine Pitch (Cross-Cut) | | **Thermal Interface Material (TIM)** | NO TIM (Pre-applied options vary, usually "None") | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the physical characteristics: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **13**: Series type (likely refers to the attachment style/height category). * **F**: Fin Pitch (Fine). * **99**: Specific dimension/pattern identifier. * **C1**: Material/Finish (Aluminum with Blue Anodize). * **R0**: Revision or specific packaging/kit code. --- ### 3. Key Components & Design 1. **Heat Sink Body**: Constructed from extruded aluminum to provide a high surface-area-to-weight ratio for heat dissipation. 2. **Cross-Cut Fin Design**: The fins are cut horizontally and vertically. This allows for multi-directional airflow, making it effective in systems where the direction of the cooling fan's exhaust might vary. 3. **Push-Pin Attachment**: This model uses a plastic push-pin and a compression spring. This ensures a consistent force (pressure) between the heat sink and the chip, which is critical for maximizing thermal transfer. --- ### 4. Application This component is typically used in: * **Networking Hardware**: Switches, routers, and gateways. * **Embedded Systems**: Industrial PCs and control units. * **Power Supplies**: To cool MOSFETs or voltage regulators. * **CPUs/GPUs**: Low-profile cooling for specialized processors.