The **ATS-14A-159-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, GPUs, and power modules. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Type** | Push Pin (Plastic) | | **Thermal Resistance** | 2.09 °C/W (at 200 LFM) | | **Thermal Resistance (Static)** | 10.70 °C/W | | **Weight** | ~45 Grams | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the heat sink fits within the spatial constraints of a Printed Circuit Board (PCB). * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 10.00 mm (Low profile) * **Pitch (Hole Spacing):** 38.00 mm --- ### 3. Key Component Features #### A. Fin Design (Cross-Cut) This model utilizes a **cross-cut fin** pattern. Unlike straight fins, cross-cut patterns create many smaller square or rectangular pillars. This increases surface area and allows air to flow through the heat sink from multiple directions (omni-directional), making it ideal for systems where the airflow direction might be inconsistent. #### B. Attachment Mechanism (Push Pin & Spring) The "R0" suffix indicates a specific mounting kit: * **Push Pins:** Made of durable plastic, these allow for quick installation into pre-drilled PCB holes. * **Compression Springs:** These provide consistent downward pressure (clamping force) to ensure the thermal interface material (TIM) makes perfect contact with the electronic chip. #### C. Thermal Interface Material (TIM) The unit typically comes with **T766** pre-applied. T766 is a high-performance thermal phase-change material that fills microscopic air gaps between the chip and the aluminum base to maximize heat transfer. --- ### 4. Application Use Cases This specific heat sink is commonly used for: 1. **Network Switches/Routers:** Cooling BGAs (Ball Grid Arrays) and FPGAs. 2. **Industrial PCs:** Compact systems where height is limited to 10mm. 3. **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators. ---