ATS-16B-159-C1-R0
AI

The part number **ATS-16B-159-C1-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
Below are the key physical and thermal characteristics of this component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Spring Type** | Compression Spring |
| **Thermal Resistance** | 2.07°C/W (at 200 LFM) |
| **Dimensions (L x W x H)** | 45mm x 45mm x 10mm |
| **Fin Style** | XCUT (Cross-cut) |
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### 2. Detailed Component Breakdown
#### A. The XCUT Fin Design
The "XCUT" geometry features a straight fin design that has been cross-cut into blocks. This allows for:
* **Omnidirectional Airflow:** It can accept airflow from any direction, making it ideal for systems where the fan placement is not directly aligned with the heat sink.
* **Increased Surface Area:** The cross-cutting creates more edges, which helps break up the boundary layer of air for better heat dissipation.
#### B. Push-Pin Mounting System
This model uses a **push-pin and compression spring** mechanism.
* **Benefit:** It provides consistent pressure on the component, ensuring high thermal interface performance.
* **Requirement:** The PCB (Printed Circuit Board) must have pre-drilled holes to accept the pins.
#### C. Thermal Interface Material (TIM)
The **"C1"** designation in the part number typically indicates that the heat sink comes pre-applied with **ATS-PPS-02** or a similar high-performance thermal phase-change material. This eliminates the need for manual thermal paste application.
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### 3. Part Number Decoder
Understanding the nomenclature helps identify the specific variant:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer: Advanced Thermal Solutions |
| **16B** | Series / Attachment Style (Push-Pin) |
| **159** | Specific size/fin configuration code |
| **C1** | Thermal Interface Material (Phase change / Blue Anodized) |
| **R0** | Revision / RoHS Compliance status |
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### 4. Typical Applications
* **Networking:** Routers, switches, and base stations.
* **Computing:** Secondary processors or chipsets on motherboards.
* **Embedded Systems:** Industrial PCs where height constraints (10mm) are a factor.
- ⤷
What are the PCB hole size requirements for the push-pin mounting?
- ⤷ How does the 10mm height impact its cooling efficiency compared to taller models?
- ⤷ Is there a version of this heat sink that uses thermal tape instead of push-pins?