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  • ATS-16B-159-C1-R0

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    The part number **ATS-16B-159-C1-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the key physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 2.07°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Style** | XCUT (Cross-cut) | --- ### 2. Detailed Component Breakdown #### A. The XCUT Fin Design The "XCUT" geometry features a straight fin design that has been cross-cut into blocks. This allows for: * **Omnidirectional Airflow:** It can accept airflow from any direction, making it ideal for systems where the fan placement is not directly aligned with the heat sink. * **Increased Surface Area:** The cross-cutting creates more edges, which helps break up the boundary layer of air for better heat dissipation. #### B. Push-Pin Mounting System This model uses a **push-pin and compression spring** mechanism. * **Benefit:** It provides consistent pressure on the component, ensuring high thermal interface performance. * **Requirement:** The PCB (Printed Circuit Board) must have pre-drilled holes to accept the pins. #### C. Thermal Interface Material (TIM) The **"C1"** designation in the part number typically indicates that the heat sink comes pre-applied with **ATS-PPS-02** or a similar high-performance thermal phase-change material. This eliminates the need for manual thermal paste application. --- ### 3. Part Number Decoder Understanding the nomenclature helps identify the specific variant: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer: Advanced Thermal Solutions | | **16B** | Series / Attachment Style (Push-Pin) | | **159** | Specific size/fin configuration code | | **C1** | Thermal Interface Material (Phase change / Blue Anodized) | | **R0** | Revision / RoHS Compliance status | --- ### 4. Typical Applications * **Networking:** Routers, switches, and base stations. * **Computing:** Secondary processors or chipsets on motherboards. * **Embedded Systems:** Industrial PCs where height constraints (10mm) are a factor.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole size requirements for the push-pin mounting?
    • ⤷ How does the 10mm height impact its cooling efficiency compared to taller models?
    • ⤷ Is there a version of this heat sink that uses thermal tape instead of push-pins?