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  • ATS-16F-182-C2-R0

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    The part number **ATS-16F-182-C2-R0** refers to a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the *pushPIN™* series, designed for efficient cooling of electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body), Copper (Optional Base) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Fin Type** | Straight Fin | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Thermal Resistance** | 7.51°C/W (Unducted Flow @ 100 LFM) | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Part Number Breakdown Understanding the nomenclature helps identify the exact variant: * **ATS**: Prefix for Advanced Thermal Solutions. * **16**: Refers to the specific series/design family. * **F**: Indicates the fin pitch/density (Fine pitch). * **182**: Unique identifier for the dimensions and hole pattern. * **C2**: Material/Finish code (Typically Blue Anodized Aluminum). * **R0**: Revision or packaging indicator. --- ### 3. Key Electronic Functions While a heatsink is a passive mechanical part, its role in an electronic circuit is critical for longevity and performance: 1. **Thermal Management:** It dissipates heat generated by semiconductor junctions into the surrounding air. 2. **Thermal Resistance Reduction:** By providing a large surface area (fins), it lowers the junction-to-ambient thermal resistance ($R_{\theta JA}$), preventing thermal throttling. 3. **Mechanical Stability:** The `pushPIN™` system ensures consistent pressure on the thermal interface material (TIM), which is vital for efficient heat transfer. --- ### 4. Thermal Performance Comparison The effectiveness of the ATS-16F-182-C2-R0 depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 7.51 | | 200 | 1.0 | 4.15 | | 300 | 1.5 | 3.32 | | 400 | 2.0 | 2.86 |
    ✨ Follow-up Questions
    • ⤷ What are the mounting hole dimensions for this specific heatsink?
    • ⤷ Does this part come with pre-applied thermal interface material (TIM)?
    • ⤷ What are the advantages of the pushPIN attachment over traditional adhesive tape?