The **ATS-17D-159-C1-R0** is a high-performance electronic component specifically designed for thermal management. Manufactured by **Advanced Thermal Solutions (ATS)**, this part is a specialized "push-pin" heat sink used to dissipate heat from integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-17D-159-C1-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 2.09°C/W (@ 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Fin Style** | XCUT (Cross-cut) | | **Thermal Interface Material (TIM)** | ATS-51 (Phase Change Material) | --- ### 2. Key Electronic Features #### A. XCUT Fin Design Unlike standard straight-fin heat sinks, the XCUT design features a cross-cut pattern. In an electronic enclosure, this allows for **multi-directional airflow**, meaning the heat sink remains efficient even if the air is not blowing directly parallel to the fins. #### B. Push-Pin Attachment The "-R0" suffix indicates a specific hardware configuration. This model uses plastic push-pins and a high-tension spring system. * **Purpose:** To provide consistent pressure across the surface of the chip. * **Safety:** Ensures that the heat sink does not shift during vibration or shipping, which could damage the delicate silicon die. #### C. Integrated Thermal Interface Material (TIM) The part comes pre-applied with **ATS-51**. This is a high-performance thermal pad or phase-change material that fills the microscopic air gaps between the chip and the aluminum base, significantly reducing thermal impedance. --- ### 3. Applications This specific heat sink is commonly found in the following electronic environments: * **Telecommunications:** Cooling high-speed networking switches. * **Embedded Systems:** Small form-factor industrial PCs. * **Power Supplies:** Managing heat for MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): ```markdown - @ 100 LFM: 3.47 °C/W - @ 200 LFM: 2.09 °C/W - @ 400 LFM: 1.41 °C/W - @ 600 LFM: 1.13 °C/W ```