The **ATS-18B-180-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Attribute | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Heat Sink Type** | Push-Pin (BGA) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 3.32°C/W (at 200 LFM) | | **Dimensions** | 35mm x 35mm x 35mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material** | T766 (High performance) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product's attributes: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **18B**: Refers to the specific series and mounting hole configuration. * **180**: Identifies the specific dimensions (35x35x35mm). * **C2**: Indicates the material/finish (Aluminum with Blue Anodized coating). * **R0**: Refers to the version or revision (Standard RoHS compliant version). --- ### 3. Key Features * **High Aspect Ratio Fins:** The "cross-cut" fin design allows for multi-directional airflow, which is ideal for systems where the fan direction might vary or be restricted. * **Pre-assembled Attachment:** It comes with pre-drilled holes and brass push-pins. These use a compression spring to ensure even pressure across the component, maximizing thermal contact. * **Pre-applied TIM:** The unit includes a pre-applied **Thermal Interface Material (T766)**, which fills microscopic air gaps between the chip and the heat sink base to improve heat transfer efficiency. * **Blue Anodized Finish:** This provides extra surface protection against corrosion and enhances radiation heat transfer. --- ### 4. Application Use-Cases 1. **Telecommunications:** Cooling of high-speed networking processors. 2. **Embedded Systems:** Industrial PCs where high-density components are packed in small enclosures. 3. **Power Electronics:** Dissipating heat from high-wattage voltage regulators or power modules.