Electronic Components Datasheet Search
  New Zealand  ▼
ALLDATASHEET.CO.NZ

X  

  • ATS-18B-76-C2-R0

  • AI
    The **ATS-18B-76-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ## 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Base Dimensions** | 45mm x 40mm | | **Height** | 15mm | | **Thermal Resistance** | 2.73°C/W @ 200 LFM | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Interface Material** | T766 (Thermal Interface Material pre-applied) | --- ## 2. Component Breakdown ### A. The maxiFLOW™ Design The "maxiFLOW" geometry features a flared fin structure. Unlike standard straight-fin heat sinks, this design increases the surface area and encourages more airflow through the fin field, significantly reducing the thermal resistance between the component junction and the ambient air. ### B. pushPIN™ Attachment The "R0" suffix indicates the use of the **pushPIN™** mounting system. - **Mechanism:** It uses a brass or plastic pin with a stainless steel spring. - **Benefit:** This ensures constant, high pressure on the component (IC), which optimizes the performance of the Thermal Interface Material (TIM). - **Hole Pattern:** It requires specific drill holes on the PCB for secure mounting. ### C. Thermal Interface Material (T766) This part comes with **T766** pre-applied to the base. This is a high-performance phase-change material or grease that fills microscopic air gaps between the heat sink and the chip, ensuring maximum heat transfer efficiency. --- ## 3. Applications This heat sink is typically found in: * **Telecommunications:** Optical modules and networking switches. * **Computing:** Embedded systems and localized cooling for power regulators. * **Industrial:** High-speed data acquisition boards where space is restricted (due to the low 15mm profile). ---
    ✨ Follow-up Questions
    • ⤷How do I calculate the correct LFM (Linear Feet per Minute) for this heat sink?
    • ⤷ What is the specific PCB hole pattern required for the pushPIN attachment?
    • ⤷ Are there alternative finishes available for higher corrosion resistance?