The **ATS-18B-92-C1-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions | Model Series: pushPIN™ | | **Part Number** | ATS-18B-92-C1-R0 | Specific configuration code | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Enhances corrosion resistance and thermal radiation | | **Dimensions** | 40mm x 40mm x 15mm | Standard square footprint | | **Thermal Resistance** | 16.40°C/W (Unducted) | Performance at natural convection/low airflow | | **Attachment Method** | pushPIN™ | Uses a spring-loaded pin mechanism | --- ### 2. Key Components & Design Features The "92" series within the ATS catalog features a unique **straight fin** design optimized for airflow efficiency. * **Heat Sink Body:** Constructed from high-quality aluminum. The fin density is balanced to allow air to pass through while maximizing surface area. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **ATS-PPS-01**, a high-performance thermal pad or grease, ensuring a seamless heat transfer from the chip to the metal. * **Attachment Mechanism:** It utilizes a **pushPIN™** system. This consists of: * **Brass or Plastic Pins:** To secure the sink to the PCB. * **Stainless Steel Springs:** To provide precise "Firm Grip" pressure, ensuring constant contact with the heat source. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the code helps in identifying variations: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **18** | Attachment Type (pushPIN™ style) | | **B** | Material/Series Type | | **92** | Specific Fin Geometry and Size | | **C1** | Thermal Performance Level / Material Grade | | **R0** | RoHS Compliant / Revision code | --- ### 4. Applications This component is typically found in: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Industrial Power Supplies:** Managing heat from MOSFETs. * **Embedded Systems:** Protecting SoCs in compact enclosures where airflow is limited.